Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: microSMD-8
External dimensions/packaging: microSMD-8
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
National | 完全替代 |
Synchronous Step-up DC-DC Converter for White LED Applications
|
|||
LM3501TLX-16
|
TI | 完全替代 | VFBGA |
Synchronous Step-up DC-DC Converter for White LED Applications
|
||
LM3501TLX-16/NOPB
|
National Semiconductor | 功能相似 | microSMD-8 |
Synchronous Step-up DC-DC Converter for White LED Applications 8-DSBGA -40℃ to 85℃
|
||
LM3501TLX-16/NOPB
|
TI | 功能相似 | WFBGA-8 |
Synchronous Step-up DC-DC Converter for White LED Applications 8-DSBGA -40℃ to 85℃
|
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