Technical parameters/digits: 24
Technical parameters/access time: 8 ns
Technical parameters/access time (Max): 8 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 119
Encapsulation parameters/Encapsulation: BGA-119
External dimensions/packaging: BGA-119
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Not Recommended for New Designs
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GS73024AB-8I
|
GSI | 功能相似 | FBGA |
SRAM Chip Async Single 3.3V 3M-bit 128K x 24Bit 8ns 119Pin FBGA Tray
|
||
IS61LV12824-8BI
|
Integrated Silicon Solution | 功能相似 | BGA |
SRAM Chip Async Single 3.3V 3M-Bit 128K x 24Bit 8ns 119Pin BGA T/R
|
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