Package parameters/number of pins: 119
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS61LV12824-8BI
|
Integrated Silicon Solution | 功能相似 | BGA |
SRAM Chip Async Single 3.3V 3M-Bit 128K x 24Bit 8ns 119Pin BGA T/R
|
||
IS61LV12824-8BL
|
Integrated Silicon Solution | 功能相似 | BGA-119 |
静态随机存取存储器 3M (128Kx24) 8ns Async 静态随机存取存储器 3.3v
|
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