Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TO-263-3
External dimensions/width: 9.65 mm
External dimensions/packaging: TO-263-3
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
FDB045AN08A0
|
Fairchild | 功能相似 | TO-263-3 |
ON Semiconductor PowerTrench 系列 Si N沟道 MOSFET FDB045AN08A0, 90 A, Vds=75 V, 3引脚 D2PAK (TO-263)封装
|
||
IRF9Z34SPBF
|
Vishay Semiconductor | 完全替代 | D2PAK-263 |
MOSFET P-CH 60V 18A D2PAK
|
||
IRF9Z34SPBF
|
Vishay Intertechnology | 完全替代 |
MOSFET P-CH 60V 18A D2PAK
|
|||
IRF9Z34SPBF
|
Vishay Siliconix | 完全替代 | TO-263-3 |
MOSFET P-CH 60V 18A D2PAK
|
||
SIHF9Z34STRL-GE3
|
Vishay Semiconductor | 功能相似 | D2PAK |
SIHF9Z34STRL-GE3 P-channel MOSFET Transistor, 13A, 60V, 3Pin D2PAK
|
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