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Model CY7C1270XV18-633BZXC
Description 36Megabit DDR II Xtreme SRAM Dual Word Burst Architecture (2.5 Cycle Read Latency) 36 Mbit DDR II Xtreme SRAM Two Word Burst Architecture (2.5 Cycle Read Latency)
Product QR code
Brand: Cypress Semiconductor
Packaging FBGA-165
Delivery time
Packaging method Tray
Standard packaging quantity 1
233.19  yuan 233.19yuan
1+:
$ 268.1639
10+:
$ 261.1683
50+:
$ 255.8050
100+:
$ 253.9396
200+:
$ 252.5404
500+:
$ 250.6750
1000+:
$ 249.5090
2000+:
$ 248.3431
Quantity
1+
10+
50+
100+
200+
Price
$268.1639
$261.1683
$255.8050
$253.9396
$252.5404
Price $ 268.1639 $ 261.1683 $ 255.8050 $ 253.9396 $ 252.5404
Start batch production 1+ 10+ 50+ 100+ 200+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(2452) Minimum order quantity(1)
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Technical parameters/digits: 36

Technical parameters/access time (Max): 0.45 ns

Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/power supply voltage: 1.7V ~ 1.9V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: FBGA-165

External dimensions/packaging: FBGA-165

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: lead-free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C1270XV18-600BZXC CY7C1270XV18-600BZXC Cypress Semiconductor 类似代替 LBGA-165
36兆位的DDR II的Xtreme SRAM双字突发架构（ 2.5周期读延迟） 36-Mbit DDR II Xtreme SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency)
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