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Model CY7C1270XV18-600BZXC
Description 36Megabit DDR II Xtreme SRAM Dual Word Burst Architecture (2.5 Cycle Read Latency) 36 Mbit DDR II Xtreme SRAM Two Word Burst Architecture (2.5 Cycle Read Latency)
Product QR code
Brand: Cypress Semiconductor
Packaging LBGA-165
Delivery time
Packaging method Tray
Standard packaging quantity 1
185.74  yuan 185.74yuan
1+:
$ 213.6033
10+:
$ 208.0310
50+:
$ 203.7590
100+:
$ 202.2730
200+:
$ 201.1586
500+:
$ 199.6727
1000+:
$ 198.7439
2000+:
$ 197.8152
Quantity
1+
10+
50+
100+
200+
Price
$213.6033
$208.0310
$203.7590
$202.2730
$201.1586
Price $ 213.6033 $ 208.0310 $ 203.7590 $ 202.2730 $ 201.1586
Start batch production 1+ 10+ 50+ 100+ 200+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7171) Minimum order quantity(1)
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Technical parameters/access time: 50 ns

Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/power supply voltage: 1.7V ~ 1.9V

Encapsulation parameters/installation method: Surface Mount

Encapsulation parameters/Encapsulation: LBGA-165

External dimensions/packaging: LBGA-165

Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C1270XV18-633BZXC CY7C1270XV18-633BZXC Cypress Semiconductor 类似代替 FBGA-165
36兆位的DDR II的Xtreme SRAM双字突发架构（ 2.5周期读延迟） 36-Mbit DDR II Xtreme SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency)
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