Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: BGA-165
External dimensions/packaging: BGA-165
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1518KV18-250BZI
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
CY7C1518AV18 72 Mb (4 M x 18) 250 MHz 1.8 V DDR-II 2-字突发 SRAM - FBGA-165
|
||
CY7C1518KV18-250BZXI
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
72兆位的DDR II SRAM的2字突发架构 72-Mbit DDR II SRAM 2-Word Burst Architecture
|
||
GS8662T18BGD-250I
|
GSI | 完全替代 | BGA-165 |
静态随机存取存储器 1.8 or 1.5V 4M x 18 72M
|
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