Technical parameters/clock frequency: 250 MHz
Technical parameters/digits: 18
Technical parameters/access time (Max): 0.45 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA-165
External dimensions/height: 0.89 mm
External dimensions/packaging: FBGA-165
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991.b.2.a
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1518AV18-250BZXI
|
Cypress Semiconductor | 完全替代 | FBGA-165 |
72兆位的DDR - II SRAM的2字突发架构 72-Mbit DDR-II SRAM 2-Word Burst Architecture
|
||
CY7C1518KV18-250BZI
|
Cypress Semiconductor | 完全替代 | FBGA-165 |
CY7C1518AV18 72 Mb (4 M x 18) 250 MHz 1.8 V DDR-II 2-字突发 SRAM - FBGA-165
|
||
GS8662T18BD-250I
|
GSI | 功能相似 | BGA-165 |
静态随机存取存储器 1.8 or 1.5V 4M x 18 72M
|
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