Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: CDIP
External dimensions/packaging: CDIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A001
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
8403610LA
|
Integrated Device Technology | 功能相似 | CDIP |
Standard SRAM, 2KX8, 55ns, CMOS, CDIP24, CERAMIC, DIP-24
|
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