Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: CDIP
External dimensions/length: 32.5 mm
External dimensions/width: 7.62 mm
External dimensions/packaging: CDIP
External dimensions/thickness: 3.56 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT6116SA55TDB
|
Integrated Device Technology | 功能相似 | CDIP |
CMOS静态RAM 16K ( 2K ×8位) CMOS STATIC RAM 16K (2K x 8 BIT)
|
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