Chip AI consultant
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Package parameters/number of pins: 780
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EP2AGX260EF29C5
|
Altera | 类似代替 | BBGA-780 |
FPGA Arria® II GX Family 244188 Cells 500MHz 40nm Technology 0.9V 780Pin FC-FBGA
|
||
EP2AGX260EF29C5
|
Intel | 类似代替 | BGA |
FPGA Arria® II GX Family 244188 Cells 500MHz 40nm Technology 0.9V 780Pin FC-FBGA
|
||
|
|
Intel | 类似代替 | FBGA-780 |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 372 IO
|
||
EP2AGX260EF29C5N
|
Altera | 类似代替 | FBGA-780 |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 372 IO
|
||
EP2AGX260EF29C6N
|
Altera | 类似代替 | FBGA-780 |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 372 IO
|
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