Technical parameters/power supply voltage: 0.87V ~ 0.93V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 780
Encapsulation parameters/Encapsulation: BBGA-780
External dimensions/packaging: BBGA-780
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EP2AGX260EF29C5
|
Altera | 类似代替 | BBGA-780 |
FPGA Arria® II GX Family 244188 Cells 500MHz 40nm Technology 0.9V 780Pin FC-FBGA
|
||
EP2AGX260EF29C5
|
Intel | 类似代替 | BGA |
FPGA Arria® II GX Family 244188 Cells 500MHz 40nm Technology 0.9V 780Pin FC-FBGA
|
||
|
|
Intel | 类似代替 | FBGA-780 |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 372 IO
|
||
EP2AGX260EF29C5N
|
Altera | 类似代替 | FBGA-780 |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 372 IO
|
||
EP2AGX260EF29C6N
|
Altera | 类似代替 | FBGA-780 |
FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 372 IO
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review