Technical parameters/power supply voltage (DC): 1.30 V, 1.65 V (max)
Technical parameters/dissipated power: 500 mW
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/dissipated power (Max): 500 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/height: 1.41 mm
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LUPXA255A0C400
|
Intel | 完全替代 | BGA-256 |
Ic Micro Processor 400MHz 256bga - Lupxa255a0c400
|
||
LUPXA255A0C400
|
Intel | 完全替代 | BGA-256 |
Ic Micro Processor 400MHz 256bga - Lupxa255a0c400
|
||
|
|
Intel | 类似代替 | BGA-256 |
MPU RISC 32Bit 0.18UM 400MHz 2.5V/3.3V
|
||
LUPXA255A0E400
|
Intel | 类似代替 | BGA-256 |
MPU RISC 32Bit 0.18UM 400MHz 2.5V/3.3V
|
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