Technical parameters/dissipated power: | 500 mW |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Technical parameters/dissipated power (Max): | 500 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 256 |
|
Encapsulation parameters/Encapsulation: | BGA-256 |
|
Dimensions/Packaging: | BGA-256 |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | 3A991.a.2 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GDPXA255A0C300
|
Intel | 完全替代 | BGA-256 |
MPU RISC 32Bit 0.18um 300MHz 2.5V/3.3V 256Pin BGA
|
||
GDPXA255A0E200
|
Intel | 完全替代 | BGA-256 |
IC MICRO PROCESSOR 200MHz 256BGA
|
||
MCF54417CMJ250
|
Freescale | 功能相似 | BGA-256 |
NXP MCF54417CMJ250 芯片, 微处理器, 32位, 250MHZ, MAPBGA-256
|
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