Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Dallas Semiconductor | 类似代替 |
1节或2节电池电量计IC 1-Cell or 2-Cell Standalone Fuel Gauge IC
|
|||
DS2781E+T&R
|
Maxim Integrated | 类似代替 | TSSOP-8 |
1节或2节电池电量计IC 1-Cell or 2-Cell Standalone Fuel Gauge IC
|
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