Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: TSSOP-8
External dimensions/packaging: TSSOP-8
Physical parameters/operating temperature: -20℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS2781E+
|
Maxim Integrated | 类似代替 | TSSOP-8 |
DS2781E+ 管装
|
||
DS2781E+
|
Dallas Semiconductor | 类似代替 | TSSOP |
DS2781E+ 管装
|
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