Technical parameters/memory capacity: 1000 B
Technical parameters/power supply voltage: 2.2V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: TSOT-23-5
External dimensions/packaging: TSOT-23-5
Physical parameters/operating temperature: -30℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS2502X1+
|
Maxim Integrated | 功能相似 | UFBGA-4 |
EPROM OTP 1Kbit 4Pages x 256 4Pin Flip-Chip
|
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