Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: UFBGA-4
External dimensions/packaging: UFBGA-4
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS25LV02R+T&R
|
Maxim Integrated | 功能相似 | TSOT-23-5 |
EPROM OTP 1Kbit 128 x 8 5Pin TSOT-23 T/R
|
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