Encapsulation parameters/Encapsulation: SIP
External dimensions/packaging: SIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8351/N6,112
|
NXP | 功能相似 | SIP-9 |
IC DC COUPLED V-DEFL 9-SIL
|
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