Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: DO-213
External dimensions/packaging: DO-213
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BZV55C3V3
|
DC Components | 功能相似 |
Zener Diode, 3.3V V(Z), 5%, 0.5W,
|
|||
|
|
Semtech Corporation | 功能相似 | LL-34 |
Zener Diode, 3.3V V(Z), 5%, 0.5W,
|
||
|
|
Philips | 功能相似 | Mini-MELF |
Zener Diode, 3.3V V(Z), 5%, 0.5W,
|
||
|
|
YONGYUTAI | 功能相似 | LL34/SOD-80 |
Zener Diode, 3.3V V(Z), 5%, 0.5W,
|
||
BZV55C3V3
|
Philips | 功能相似 | Mini-MELF |
Zener Diode, 3.3V V(Z), 5%, 0.5W,
|
||
BZV55C3V3
|
Central Semiconductor | 功能相似 |
Zener Diode, 3.3V V(Z), 5%, 0.5W,
|
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