Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: Mini-MELF
External dimensions/packaging: Mini-MELF
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BZT52C3V3-7-F
|
Diodes | 功能相似 | SOD-123 |
BZT52C3V3-7-F 编带
|
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