Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: D2PAK
External dimensions/packaging: D2PAK
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BYV32EB-200
|
NXP | 功能相似 | TO-263 |
Rectifier diodes ultrafast, rugged
|
||
|
|
We En Semiconductor | 功能相似 | D2PAK |
Rectifier diodes ultrafast, rugged
|
||
BYV32EB-200
|
Philips | 功能相似 |
Rectifier diodes ultrafast, rugged
|
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