Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | TO-263 |
|
Dimensions/Packaging: | TO-263 |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BYV32EB-200,118
|
NXP | 功能相似 | TO-263-3 |
NXP BYV32EB-200,118 快速/超快二极管, 双共阴极, 200 V, 20 A, 1.15 V, 25 ns, 137 A
|
||
BYV32EB-200,118
|
Philips | 功能相似 | D2PAK |
NXP BYV32EB-200,118 快速/超快二极管, 双共阴极, 200 V, 20 A, 1.15 V, 25 ns, 137 A
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review