Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: SOT422A
External dimensions/packaging: SOT422A
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BLS2731-50,114
|
NXP | 功能相似 | SOT-422 |
Trans GP BJT NPN 75V 3Pin CDFM Blister
|
||
|
|
Philips | 功能相似 | CDFM |
Trans GP BJT NPN 75V 3Pin CDFM Blister
|
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