Technical parameters/number of pins: 3
Technical parameters/dissipated power: 250 mW
Technical parameters/input capacitance: 4.5 pF
Technical parameters/breakdown voltage (collector emitter): 32 V
Technical parameters/minimum current amplification factor (hFE): 215 @2mA, 5V
Technical parameters/Maximum current amplification factor (hFE): 215 @2mA, 5V
Technical parameters/rated power (Max): 250 mW
Technical parameters/DC current gain (hFE): 150
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 250 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: SOT-23-3
External dimensions/length: 3 mm
External dimensions/width: 1.4 mm
External dimensions/height: 1 mm
External dimensions/packaging: SOT-23-3
Physical parameters/operating temperature: 150℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Power Management, Industrial
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BAT85,113
|
Nexperia | 功能相似 | DO-34 |
肖特基势垒二极管，200mA 至 500mA，Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
|
||
BAT85,113
|
NXP | 功能相似 | DO-204AG |
肖特基势垒二极管，200mA 至 500mA，Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
|
||
BCW30,215
|
Nexperia | 类似代替 | SOT-23-3 |
NXP BCW30,215 单晶体管 双极, 通用, PNP, -32 V, 100 MHz, 250 mW, -100 mA, 150 hFE
|
||
BCW30,235
|
Nexperia | 完全替代 | SOT-23-3 |
TRANS PNP 32V 0.1A SOT23
|
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