Technical parameters/frequency: 100kHz ~ 150kHz
Encapsulation parameters/Encapsulation: Die
External dimensions/packaging: Die
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microchip | 完全替代 | BUMP DIE/ WAFER (WB) |
NFC/RFID Tag and Transponder IC 100kHz to 150kHz 363Bit Automotive Wafer T/R
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review