Technical parameters/frequency: 100kHz ~ 150kHz
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/Encapsulation: BUMP DIE/ WAFER (WB)
External dimensions/packaging: BUMP DIE/ WAFER (WB)
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microchip | 功能相似 |
IC RFID 128Bit 330pF WAFER
|
|||
ATA5575M2330-DBN
|
Microchip | 完全替代 | DIE |
IC RFID IDIC R/W 128Bit TAPE
|
||
|
|
Microchip | 功能相似 |
IC RFID R/W BUMP WAFER
|
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