Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GS74117AGX-8
|
GSI | 类似代替 | FBGA |
SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 8ns 48Pin FBGA Tray
|
||
|
|
GSI | 功能相似 | BGA-119 |
静态随机存取存储器 3.3V 256K x 16 4M C Temp
|
||
GS74117AX-8I
|
GSI | 功能相似 | TFBGA |
SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 8ns 48Pin FBGA Tray
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review