Technical parameters/access time: 8 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: BGA-119
External dimensions/packaging: BGA-119
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GS74117AGX-8
|
GSI | 功能相似 | FBGA |
SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 8ns 48Pin FBGA Tray
|
||
GS74117AGX-8I
|
GSI | 功能相似 | FBGA |
SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 8ns 48Pin FBGA Tray
|
||
|
|
GSI | 功能相似 | BGA-119 |
静态随机存取存储器 3.3V 256K x 16 4M C Temp
|
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