Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: SOT-23
External dimensions/packaging: SOT-23
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Siemens AG | 功能相似 | SOT-23 |
SOT-23 - Power Transistor and Darlingtons
|
||
BF840
|
Philips | 功能相似 | TO-236 |
SOT-23 - Power Transistor and Darlingtons
|
||
BF840
|
Infineon | 功能相似 | SOT-23 |
SOT-23 - Power Transistor and Darlingtons
|
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