Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-236
External dimensions/packaging: TO-236
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BCV47,215
|
Nexperia | 类似代替 | SOT-23-3 |
NXP BCV47,215 单晶体管 双极, 达林顿, NPN, 60 V, 220 MHz, 250 mW, 500 mA, 10000 hFE
|
||
BCV47,215
|
Philips | 类似代替 | TO-236 |
NXP BCV47,215 单晶体管 双极, 达林顿, NPN, 60 V, 220 MHz, 250 mW, 500 mA, 10000 hFE
|
||
BCV47,235
|
Nexperia | 完全替代 | SOT-23-3 |
达林顿晶体管 TRANS DARLINGTON
|
||
BCV47TA
|
Diodes | 功能相似 | SOT-23-3 |
BCV47 系列 NPN 60 V 500 mA 330 mW 达林顿 晶体管 - SOT-23
|
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