Technical parameters/minimum current amplification factor (hFE): 40
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 200 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: UMT
External dimensions/length: 2.2 mm
External dimensions/width: 1.35 mm
External dimensions/height: 1 mm
External dimensions/packaging: UMT
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BC817-25W,115
|
NXP | 功能相似 | SOT-323-3 |
Nexperia BC817-25W,115 , NPN 晶体管, 500 mA, Vce=45 V, HFE:40, 100 MHz, 3引脚 UMT封装
|
||
BC817-25W,115
|
Nexperia | 功能相似 | SOT-323-3 |
Nexperia BC817-25W,115 , NPN 晶体管, 500 mA, Vce=45 V, HFE:40, 100 MHz, 3引脚 UMT封装
|
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