Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 2.3V ~ 2.7V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FBGA-484
External dimensions/length: 23 mm
External dimensions/width: 23 mm
External dimensions/height: 1.73 mm
External dimensions/packaging: FBGA-484
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
APA450-FG484
|
Microsemi | 完全替代 | FBGA-484 |
FPGA - 现场可编程门阵列 ProASIC Plus
|
||
APA450-FG484I
|
Microsemi | 类似代替 | FBGA-484 |
Field Programmable Gate Array, 450000Gates, 180MHz, 12288-Cell, CMOS, PBGA484, 1MM PITCH, FBGA-484
|
||
|
|
Actel | 功能相似 | BGA |
Field Programmable Gate Array, 450000Gates, 180MHz, 12288-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
||
APA450-FGG484I
|
Microsemi | 功能相似 | BGA-484 |
Field Programmable Gate Array, 450000Gates, 180MHz, 12288-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
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