Technical parameters/frequency: 180 MHz
Technical parameters/RAM size: 110592 b
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.3V ~ 2.7V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FBGA-484
External dimensions/packaging: FBGA-484
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
APA450-FG484
|
Microsemi | 类似代替 | FBGA-484 |
FPGA - 现场可编程门阵列 ProASIC Plus
|
||
APA450-FGG484
|
Actel | 类似代替 | BGA |
FPGA - 现场可编程门阵列 ProASIC Plus
|
||
|
|
Actel | 完全替代 | BGA |
Field Programmable Gate Array, 450000Gates, 180MHz, 12288-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
||
APA450-FGG484I
|
Microsemi | 完全替代 | BGA-484 |
Field Programmable Gate Array, 450000Gates, 180MHz, 12288-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
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