Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74ALVCH16827DGGS
|
Nexperia | 功能相似 | TFSOP-56 |
Buffer/Line Driver 20CH Non-Inverting 3-ST CMOS 56Pin TSSOP II Tube
|
||
74ALVCH16827DGGS
|
NXP | 功能相似 | TFSOP-56 |
Buffer/Line Driver 20CH Non-Inverting 3-ST CMOS 56Pin TSSOP II Tube
|
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