Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TFSOP-56
External dimensions/height: 1.05 mm
External dimensions/packaging: TFSOP-56
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74ALVCH16827DGG:11
|
NXP | 功能相似 | SOT-364-56 |
Buffer/Line Driver 20CH Non-Inverting 3-ST CMOS 56Pin TSSOP Tube
|
||
74ALVCH16827DGG:11
|
Nexperia | 功能相似 |
Buffer/Line Driver 20CH Non-Inverting 3-ST CMOS 56Pin TSSOP Tube
|
|||
|
|
NXP | 功能相似 | TFSOP-56 |
IC BUFFER/LINE DVR 20Bit 56TSSOP
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review