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Model 72V82L20PA8
Description FIFO Mem Async Dual Depth/Width Bi-Dir 1K x 9 x 2 56Pin TSSOP T/R
Product QR code
Brand: Integrated Device Technology
Packaging TFSOP-56
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
68.07  yuan 68.07yuan
1+:
$ 78.2759
10+:
$ 74.8726
100+:
$ 74.2600
250+:
$ 73.7835
500+:
$ 73.0348
1000+:
$ 72.6945
2500+:
$ 72.2180
5000+:
$ 71.8096
Quantity
1+
10+
100+
250+
500+
Price
$78.2759
$74.8726
$74.2600
$73.7835
$73.0348
Price $ 78.2759 $ 74.8726 $ 74.2600 $ 73.7835 $ 73.0348
Start batch production 1+ 10+ 100+ 250+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(3449) Minimum order quantity(1)
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Technical parameters/access time: 20 ns

Technical parameters/power supply voltage: 3V ~ 3.6V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 56

Encapsulation parameters/Encapsulation: TFSOP-56

External dimensions/length: 14.0 mm

External dimensions/width: 6.10 mm

External dimensions/packaging: TFSOP-56

External dimensions/thickness: 1.00 mm

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Contains Lead

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
72V82L15PAG8 72V82L15PAG8 Integrated Device Technology 类似代替 TFSOP-56
先进先出 1K x 9 DualAsync 先进先出 3.3V 15ns
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