Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71V416YL10BE
|
Integrated Device Technology | 功能相似 | BGA |
SRAM Chip Async Single 3.3V 4M-bit 256K x 16 10ns 48Pin CABGA Tray
|
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