Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: BGA
External dimensions/height: 0.85 mm
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT71V416L10BEG
|
Integrated Device Technology | 功能相似 | BGA |
3.3V CMOS静态RAM 4 MEG ( 256K ×16位) 3.3V CMOS Static RAM 4 Meg (256K x 16-Bit)
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