Technical parameters/clock frequency: 133 MHz
Technical parameters/access time: 4.2 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.4V ~ 2.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: CABGA-256
External dimensions/length: 17 mm
External dimensions/width: 17 mm
External dimensions/height: 1.76 mm
External dimensions/packaging: CABGA-256
External dimensions/thickness: 1.76 mm
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards:
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70T3509MS133BP
|
Integrated Device Technology | 类似代替 | CABGA-256 |
1024K x 36 Sync, 3.3V/2.5V Dual-Port RAM
|
||
70T3509MS133BPG
|
Integrated Device Technology | 完全替代 | BGA-256 |
1024K x 36 Sync, 3.3V/2.5V Dual-Port RAM
|
||
70T3509MS133BPGI
|
Integrated Device Technology | 完全替代 | CABGA-256 |
1024K x 36 Sync, 3.3V/2.5V Dual-Port RAM
|
||
|
|
Renesas Electronics | 完全替代 | CABGA-256 |
1024K x 36 Sync, 3.3V/2.5V Dual-Port RAM
|
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