Technical parameters/power supply voltage: 2.4V ~ 2.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/length: 17.0 mm
External dimensions/width: 17.0 mm
External dimensions/packaging: BGA-256
External dimensions/thickness: 1.76 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70T3509MS133BP
|
Integrated Device Technology | 完全替代 | CABGA-256 |
1024K x 36 Sync, 3.3V/2.5V Dual-Port RAM
|
||
70T3509MS133BPGI
|
Integrated Device Technology | 完全替代 | CABGA-256 |
1024K x 36 Sync, 3.3V/2.5V Dual-Port RAM
|
||
|
|
Renesas Electronics | 完全替代 | CABGA-256 |
1024K x 36 Sync, 3.3V/2.5V Dual-Port RAM
|
||
70T3509MS133BPI
|
Integrated Device Technology | 完全替代 | CABGA-256 |
静态随机存取存储器 1024Kx36 STD-PWR 2.5V DUAL PORT RAM
|
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