Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
501M
|
Bourns J.W. Miller | 功能相似 |
IC 6 A HB BASED PRPHL DRVR WITH PWM, CDIP24, CERDIP-24, Peripheral Driver
|
|||
5962-9232501MXA
|
TI | 功能相似 | DIP |
3A , 55V H桥 3A, 55V H-Bridge
|
||
5962-9232501MXA
|
National Semiconductor | 功能相似 | DIP |
3A , 55V H桥 3A, 55V H-Bridge
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review