Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 329
Encapsulation parameters/Encapsulation: BBGA-329
External dimensions/packaging: BBGA-329
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A54SX32A-1BGG329
|
Microsemi | 功能相似 | BBGA-329 |
FPGA - 现场可编程门阵列 A54SX32A-1BGG329
|
||
A54SX32A-1BGG329
|
SOC | 功能相似 | BBGA-329 |
FPGA - 现场可编程门阵列 A54SX32A-1BGG329
|
||
A54SX32A-BG329I
|
Microsemi | 功能相似 | BGA-329 |
FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 329Pin BGA
|
||
A54SX32A-BGG329
|
Microsemi | 功能相似 | BBGA-329 |
FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 329Pin BGA
|
||
A54SX32A-BGG329
|
Actel | 功能相似 | BGA |
FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 329Pin BGA
|
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