Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FBGA
External dimensions/length: 23 mm
External dimensions/width: 23 mm
External dimensions/height: 1.73 mm
External dimensions/packaging: FBGA
Compliant with standards/RoHS standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3PE3000-1FG484I
|
SOC | 完全替代 | BGA-484 |
ProASIC3E闪存系列FPGA具有可选的软ARM支持 ProASIC3E Flash Family FPGAs with Optional Soft ARM Support
|
||
A3PE3000-1FG484I
|
Microsemi | 完全替代 | FBGA-484 |
ProASIC3E闪存系列FPGA具有可选的软ARM支持 ProASIC3E Flash Family FPGAs with Optional Soft ARM Support
|
||
A3PE3000-FG484I
|
SOC | 完全替代 | BGA-484 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 484Pin FBGA
|
||
A3PE3000-FG484I
|
Microsemi | 完全替代 | FBGA-484 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 484Pin FBGA
|
||
A3PE3000-FG484I
|
Microchip | 完全替代 | FBGA |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 484Pin FBGA
|
||
M1A3PE3000-2FG484I
|
SOC | 完全替代 | BGA-484 |
FPGA ProASIC 3E Family 3M Gates 310MHz 130nm Technology 1.5V 484Pin FBGA
|
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