Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-484
External dimensions/packaging: BGA-484
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3PE3000-1FG484I
|
SOC | 完全替代 | BGA-484 |
ProASIC3E闪存系列FPGA具有可选的软ARM支持 ProASIC3E Flash Family FPGAs with Optional Soft ARM Support
|
||
A3PE3000-1FG484I
|
Microsemi | 完全替代 | FBGA-484 |
ProASIC3E闪存系列FPGA具有可选的软ARM支持 ProASIC3E Flash Family FPGAs with Optional Soft ARM Support
|
||
A3PE3000-FG484I
|
SOC | 完全替代 | BGA-484 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 484Pin FBGA
|
||
A3PE3000-FG484I
|
Microsemi | 完全替代 | FBGA-484 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 484Pin FBGA
|
||
A3PE3000-FG484I
|
Microchip | 完全替代 | FBGA |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 484Pin FBGA
|
||
M1A3PE3000-2FG484I
|
SOC | 完全替代 | BGA-484 |
FPGA ProASIC 3E Family 3M Gates 310MHz 130nm Technology 1.5V 484Pin FBGA
|
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