Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 324
Encapsulation parameters/Encapsulation: FBGA-324
External dimensions/packaging: FBGA-324
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3PE3000-FG324
|
SOC | 完全替代 | BGA-324 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 324Pin FBGA
|
||
A3PE3000-FG324I
|
Microsemi | 完全替代 | FBGA-324 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 324Pin FBGA
|
||
A3PE3000-FG324I
|
SOC | 完全替代 | BGA-324 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 324Pin FBGA
|
||
|
|
SOC | 完全替代 | BGA-324 |
ProASIC3E闪存系列FPGA具有可选的软ARM支持 ProASIC3E Flash Family FPGAs with Optional Soft ARM Support
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review