Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-324
External dimensions/packaging: BGA-324
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3PE3000-2FG324I
|
SOC | 完全替代 | BGA-324 |
FPGA - 现场可编程门阵列 A3PE3000-2FG324I
|
||
|
|
SOC | 完全替代 | BGA-324 |
FPGA ProASIC®3E Family 3M Gates 310MHz 130nm Technology 1.5V 324Pin FBGA
|
||
A3PE3000-2FGG324I
|
Microsemi | 完全替代 | FBGA-324 |
FPGA ProASIC®3E Family 3M Gates 310MHz 130nm Technology 1.5V 324Pin FBGA
|
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