Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 256 KB
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: BGA-484
External dimensions/packaging: BGA-484
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A2F200M3F-1FG484
|
Microsemi | 完全替代 | BGA-484 |
的SmartFusion可定制系统级芯片( CSOC ) SmartFusion Customizable System-on-Chip (cSoC)
|
||
A2F200M3F-1FGG484I
|
Microsemi | 功能相似 | FPBGA-484 |
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V
|
||
A2F200M3F-FGG484
|
Microsemi | 完全替代 | FPBGA-484 |
A2F200 系列 200 K Gates 36 kb RAM 161 I/O SmartFusion cSoC - FBGA-484
|
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