Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 256 KB
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FPBGA-484
External dimensions/packaging: FPBGA-484
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A2F200M3F-FG484I
|
Microsemi | 完全替代 | FPBGA-484 |
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 484Pin FBGA
|
||
A2F200M3F-FGG484
|
Microsemi | 类似代替 | FPBGA-484 |
A2F200 系列 200 K Gates 36 kb RAM 161 I/O SmartFusion cSoC - FBGA-484
|
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