Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: TFBGA-64
External dimensions/packaging: TFBGA-64
Physical parameters/operating temperature: -20℃ ~ 85℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Other/Manufacturing Applications: Camera, mobile phone, media player
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA19988BET/C1,151
|
NXP | 类似代替 | TFBGA-64 |
TDA19988BET - 1.4a 发送器 不带HDCP加密引擎 - TFBGA-64
|
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